IMPACT-EMAP 2020 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on Oct. 21st -23rd at Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2020. For grasping the latest trend, the symposium this year highlights the theme “IMPACT-EMAP on HPC - Toward the Data Era”. In the big data era, the fifth-generation (5G) mobile communication network brings out innovative technologies like mmWave and MIMO, which will change everything we know in cellular systems. Driven by high-frequency and high-speed transmission, the demand for processing huge amounts of information has emerged. Big data processing and high-speed computing have become key requirements for the development of the new generation.
IMPACT-EMAP 2020 looks at the cutting-edge technological applications. With the increasing numbers of artificial intelligence (AI) and high-performance data analytics (HPDA), there is a need to expand high-performance computing infrastructure to cope with the challenges of machine learning, deep learning and enable to gain better understanding of digital data. That makes the HPC infrastructure more indispensable than ever.
IMPACT-EMAP 2020 will arrange plenary speeches, special sessions, industrial sessions, invited talks, and outstanding paper and poster presentations. Meanwhile, this conference will keep collaborating with international organizations such as ICEP、JIEP from Japan, KAIST from South Korea, and iNEMI from USA in this year’s gathering.
【議 程】
【IMPORTANT DATE】
Item
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Date
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Remark
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Abstract Submission Deadline(Camera-ready Version)
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June 15
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400-500 words
Submit on-line www.impact.org.tw
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Abstract Acceptance Notification
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July 15
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Notice sent via email
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Advanced Program Online
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August 14
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Advanced program announcement
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Full Paper Submission
(Camera-ready Version)
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August 28
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4 pages including figures and tables.
Submitting on-line through conference website and IEEE copyright forms due
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【SCOPE OF PAPER SOLICITED】
Packaging
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PCB
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P1. Advanced Packaging Technologies
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B1. Advanced and Green Materials and Process
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P2. Power Electronics Packaging
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B2. Test, Quality, AOI, Inspection and Reliability
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P3. Heterogeneous Integration
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B3. HDI and Embedded Technology(Fine and ultra fine line technology for Rigid、Flex 、Rigid/Flex and IC substrate)
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P4. Wearable Technologies
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B4. Electro Deposition and Electrochemical Processing Technology
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P5. Interconnections & Nanotechnology
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B5. Smart Manufacturing and Automation
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P6. Design, Modeling& Testing
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P7. Thermal Management
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P8. Advanced Sensor &Microsystems Technology (MST)
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P9. Advanced Materials, Automatic Process & Assembly
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P10. Emerging Systems Packaging Technologies
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