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活動名稱 IMPACT-EMAP 2020 Call for Papers
活動日期 2020-06-15
地  點 Taipei Nangang Exhibition Center
主辦單位 IMPACT-EMAP 2020
協辦單位 Taiwan Printed Circuit Association (TPCA)
報名方式 Tel:+886-3-3815659 #407 Cindy #404 Sophia #405 Chelsea Fax:+886-3-3815150 Email:service@impact.org.tw
報名截止日期 2020-07-15
聯絡窗口 IMPACT-EMAP 2020 Secretariat :Taiwan Printed Circuit Association (TPCA) Tel:+886-3-3815659 #407 Cindy #404 Sophia #405 Chelsea Fax:+886-3-3815150 Email:service@impact.org.tw
 

IMPACT-EMAP 2020 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan. This year will be held on Oct. 21st -23rd at Taipei Nangang Exhibition Center, in conjunction with TPCA Show 2020. For grasping the latest trend, the symposium this year highlights the theme “IMPACT-EMAP on HPC - Toward the Data Era”. In the big data era, the fifth-generation (5G) mobile communication network brings out innovative technologies like mmWave and MIMO, which will change everything we know in cellular systems. Driven by high-frequency and high-speed transmission, the demand for processing huge amounts of information has emerged. Big data processing and high-speed computing have become key requirements for the development of the new generation.

IMPACT-EMAP 2020 looks at the cutting-edge technological applications. With the increasing numbers of artificial intelligence (AI) and high-performance data analytics (HPDA), there is a need to expand high-performance computing infrastructure to cope with the challenges of machine learning, deep learning and enable to gain better understanding of digital data. That makes the HPC infrastructure more indispensable than ever.

IMPACT-EMAP 2020 will arrange plenary speeches, special sessions, industrial sessions, invited talks, and outstanding paper and poster presentations. Meanwhile, this conference will keep collaborating with international organizations such as ICEPJIEP from Japan, KAIST from South Korea, and iNEMI from USA in this years gathering.

 



【議  程】

IMPORTANT DATE

Item

Date

Remark

Abstract Submission Deadline(Camera-ready Version)

June 15

400-500 words
Submit on-line
www.impact.org.tw

Abstract Acceptance Notification

July 15

Notice sent via email

Advanced Program Online

August 14

Advanced program announcement

Full Paper Submission
(Camera-ready Version)

August 28

4 pages including figures and tables.
Submitting on-line through conference website and IEEE copyright forms due

SCOPE OF PAPER SOLICITED

Packaging

PCB

P1. Advanced Packaging Technologies

B1. Advanced and Green Materials and Process

P2. Power Electronics Packaging

B2. Test, Quality, AOI, Inspection and Reliability

P3. Heterogeneous Integration

B3. HDI and Embedded Technology(Fine and ultra fine line technology for RigidFlex Rigid/Flex and IC substrate)

P4. Wearable Technologies

B4. Electro Deposition and Electrochemical Processing Technology

P5. Interconnections & Nanotechnology

B5. Smart Manufacturing and Automation

P6. Design, Modeling& Testing

 

P7. Thermal Management

 

P8. Advanced Sensor &Microsystems Technology (MST)

 

P9. Advanced Materials, Automatic Process & Assembly

 

P10. Emerging Systems Packaging Technologies

 

 

 
 
 

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