Time
|
Topic
|
Speaker
|
9:00~9:30
|
Registration
|
|
9:30~9:35
|
Opening
|
Dr. Wei-chung Lo. Director, EOL/ITRI
|
9:35-10:15
|
Wafer to Wafer and Chip to Wafer stacking technology for 3D Integration – Advances in Process and Equipment Technology
|
Mr. Markus Wimplinger, EVG
|
10:15-10:55
|
Room Temperature Wafer Bonder by Surface Activation
|
Mr. Kensuke Ide
Mitsubishi Heavy Industries.
|
10:55-11:05
|
Break
|
|
11:05-11:45
|
SUSS 3D-IC Solutions
|
Ms. Ulrike Schoembs, Product Manager, SUSS
|
11:45-12:25
|
Electroless Plating for Under Bump Metallization in high volume production
|
Mr. Toru Imori
JX Nippon Mining & Metals
|
12:25~14:00
|
Lunch
|
|
14:00~15:00
|
3DIC & TSV business update
2.5D Glass & Silicon interposer substrate update
|
Mr. Jerome BARON, Yole
|
15:00~15:10
|
Break
|
|
15:10~15:40
|
MEMS Packaging : technology & market trends
|
Mr. Jerome BARON, Yole
|
15:40~16:00
|
Q & A
|
Mr. Jerome BARON, Yole
|