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活動名稱 2.5/3DIC技術研討會
活動日期 2014-04-30
地  點 工研院中興院區51館2B會議室(竹東鎮中興路四段195號)
主辦單位 先進堆疊系統與應用研發聯盟(Ad-STAC)
協辦單位 先進微系統與構裝技術聯盟(AMPA)
報名方式 限會員報名參加, 每一會員有二位名額, 非會員無法報名參加 請將報名資料直接email to: alantsai@itri.org.tw
報名費用 Free
報名截止日期 2015-04-23
聯絡窗口 蔡崇彬 TEL:(03)5917408 Email:alantsai@itri.org.tw
附件檔案    報名表
講  師 Brief Biography

Carl Engblom Director of Ericsson Group Function Technology Management, Sweden

Carl Engblom was born 1951 in northern Sweden. He received his M. Sc. in Eng. Physics 1974 at the Royal Institute of Technology (RIT), Stockholm, Sweden and a Ph.D. in Mathematics at RIT in 1984 where he also continued to work as a lecturer and research fellow until 1987. Between 1984 and 1996 co-founder of three startups which all were focusing on signal processing application primarily for defense industry, telecommunication, medical and space industry. In general these applications ranged from various advanced signal processing algorithms, to SW implementations of these and advanced purpose-built HW. Joined Ericsson in 1996 and has since then held various R&D position within the company. Carl Engblom is currently working with technology implementation strategies within the CTO office at Ericsson HQ in Sweden.
 

本技術研討會邀請Carl Engblom分享主題為“Aspects of 2.5/3D-integration from a systems developer’s perspective”讓與會者更加瞭解2.5/3D IC技術的發展與應用,請您撥冗參加此盛會。



【議  程】

 

09:30~09:50

Registration

 

09:50~10:00

Opening

顧子琨  組長/電光所

10:00~10:40

Section 1

Carl Engblom

10:40~10:50

Break

 

10:50~11:50

Section 2

 Carl Engblom

11:50~12:00

Q & A

顧子琨  組長/電光所

 
 

 
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