Time

Topic

Speaker

9:00~9:30

Registration

9:30~9:35

Opening

Dr. Wei-chung Lo. Director, EOL/ITRI

9:35-10:15

Wafer to Wafer and Chip to Wafer stacking technology for 3D Integration – Advances in Process and Equipment Technology

Mr. Markus Wimplinger, EVG

10:15-10:55

Room Temperature Wafer Bonder by Surface Activation

Mr. Kensuke Ide

Mitsubishi Heavy Industries.

10:55-11:05

Break

11:05-11:45

SUSS 3D-IC Solutions

Ms. Ulrike Schoembs, Product Manager, SUSS

11:45-12:25

Electroless Plating for Under Bump Metallization in high volume production

Mr. Toru Imori

JX Nippon Mining & Metals

12:25~14:00

Lunch

14:00~15:00

3DIC & TSV business update

2.5D Glass & Silicon interposer substrate update

Mr. Jerome BARON, Yole

15:00~15:10

Break

15:10~15:40

MEMS Packaging : technology & market trends

Mr. Jerome BARON, Yole

15:40~16:00

Q & A

Mr. Jerome BARON, Yole