CALL FOR PAPERS
The Leading International Components, Packaging, and Manufacturing Technology Symposium
IEEE CPMT Symposium Japan 2014
November 4-6, 2014,
Kyoto University Clock Tower Centennial Hall, KYOTO, JAPAN
http://www.vlsi-pkg-ws.org/
“Packaging for Future Optoelectronics, RF/High-Speed Electronics
and Bioelectronics”
“IEEE CPMT Symposium Japan” is recognized international symposium for leading-edge packaging
technologies. The symposium started as “The VLSI Packaging Workshop in Japan” in 1992 and held
every two years. To cover the wide area of electronics packaging, the committee refurbished the
workshop, and started the new symposium in 2010. And due to ever increasing recent electronics
demands, we expanded it to an annual event in 2013.
IEEE CPMT Symposium Japan will provide component, packaging, and manufacturing researchers who
are extending their activities beyond borders with opportunities to exchange technical knowledge and
perspective. This year's Symposium will mainly focus on packaging technologies for optoelectronics,
RF/high-speed electronics and bioelectronics. And other topics of primary interest to the participants are
listed below. Bring your latest research results and share with the participants who are experts from the
industry and the academia, and discuss with them. Anybody contributing to the achievement of a
sustainable society through electronics is very welcome at this symposium.