時 間

議 題 名 稱

講  師

9:30~10:00

Registration

10:00~10:05

Opening Remark

Dr. Carlos Diaz/TSMC

10:05~10:25

A&P Technology Roadmap (2013 summer meeting) Update

Dr. W. Chen Chair/IEEE CPMT

10:25~10:45

RF Wireless Technology Roadmap (2013 summer meeting) Update

廖錫卿 組長/工研院

10:45~11:00

Break

11:00~11:25

3D IC Product Application Market Trend

陳玲君 研究員/工研院工經中心

11:25~12:30

A&P Tables and technology challenge -- Discussion

Dr. W. Bottoms Chair/ITRS AP  iTWG

12:30~13:30

Lunch

13:30~13:55

Enabling smart 4G applications with 3DIC Technology

沈里正 副處長/廣達

13:55~14:20

Advanced  3DIC Interposer

胡迪群 資深副總/欣興

14:20~14:45

ITRI (& Ad-STAC)_ 3DIC Technology Development Update

駱韋仲 組長/工研院

14:45~15:00

Break

15:00~16:00

Status of 2.5D and 3D IC Integration Manufacturing

Dr. John H. Lau

特聘專家/工研院電光所

16:00~16:15

ITRS 2013 Winter Meeting Planning

李榮賢副組長/工研院

16:15~16:30

Wrap Up

Dr. W. Bottoms Chair/ITRS AP  iTWG