Time

Topic

Speaker

9:00~9:30

Registration

9:30~9:40

Opening Remark

Ming-Jer Kao, Deputy Gen. Dir./ITRI

Douglas C. H. Yu Sen. Dir./TSMC (TBC)

W. Bottoms, Chair/ITRS AP iTWG

9:40~10:15

Wearable Electronic Market Trends

Mao-Jung Peng Manager/ITRI IEK

10:15~10:50

Microelectronics packaging technologies for the ITRS 2.0 era.

Mike Ma, VP/SPIL

10:50~11:10

Coffee Break

11:10~11:45

Wearable Electronic Applications(TBC)

Li-Cheng Shen

Sen. Dir. Quanta Computer

11:45~12:20

AP & RF Summer Meeting Update

W. Chen, Chair/IEEE CPMT

12:20~13:30

Lunch

13:30~14:10

AP & RF Roadmap

W. Bottoms, Chair/ITRS AP iTWG

14:10~14:45

Integrate or be integrated

(TBC)

Robert W. C. Lo Director/ITRI(TBC)

14:45~15:20

SiP Integration in Wearables

George Tai, President/ChipSiP

15:20~15:40

Coffee Break

15:40~16:15

RF or mmwave for IoT

Jason Lee VP/Boardtek(TBC)

16:15~16:50

Advenced substrate

D.C. Hu VP/Unimicron (TBC)

16:50~17:00

2015 Winter Meeting & Wrap Up

Sebastian S. C. Liau Director/ITRI