Time

Topic 

Speaker

9:00～9:30

Registration

9:30～9:35

Opening

Dr. Wei-Chung Lo Director/ITRI

9:35～9:55

3D packaging trials by Research Center for Tree-Dimensional Semiconductors

Prof. Hajime Tomokage

(IEC TC91 WG6 Convener)

Fukuoka Univ., Japan

9:55～10:15

The international standard trend of 3D-device embedding technology

Mr. Hisao Kasuga

(IEC TC91 WG6 Convener)

IS-INOTEK, Japan

10:15～10:35

The international standard trend of electronic design languages and data formats

Mr. Satoshi Kojima

(IEC TC91 WG11 Convener)

KOJIMA eDesign Office, Japan

10:35～10:50

            Break

10:50～11:10

3D technology and co-design of LSI/substrate/PCB by CAD system

Mr. Masaomi Suzuki

Manager, ZUKEN Taiwan Inc.

11:10～11:30

ITRI 3D Packaging Technology

Dr. Wei-Chung Lo Director/ITRI

11:30～12:00

Closing

Prof. Hajime Tomokage

12:00～13:00

Lunch box